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 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
SUPER BRIGHT ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LDUR63533/L35
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LDUR63533/L35 B 11 - Apr. - 2007
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDUR63533/L35 Page 1/5
Package Dimensions
5.0
5.6
7.6
8.6
1.5MAX 25.0MIN
1/4
0.5 TYP
1.0MIN 2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Directivity Radiation
0X -30X 30X
-60X
60X
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDUR63533/L35 Page 2/5
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol DUR Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg 30 90 120 10 150 -40 ~ +85 -40 ~ +100 mA mA mW UNIT
g A V J J
Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded.
Typical Electrical & Optical Characteristics (Ta=25 J)
PART NO
COLOR MATERIAL Emitted Lens Water Clear
Dominant Spectral Forward voltage wave halfwidth @ 20mA(V) length f nm f Dnm
Luminous intensity @20mA(mcd)
Viewing angle 2c 1/2 (deg)
Min. Max. Min. 625 20 1.7 2.6
Typ. 22
LDUR63533/L35
AlGaInP
Red
9500 11500
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDUR63533/L35 Page 3/5
Typical Electro-Optical Characteristics Curve
DUR CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Light Output Power vs. Forward Current
140
120 100 80
Forward Current(mA)
120 100 80 60 40 20 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0
LOP(%)
60 40 20 0.0 0.0 20 40 60 80 100 120 140
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
0
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity@20mA Normalize @20J
30 40 50 60 70 80 90
Forward Voltage@20mA Normalize @20J
-0.05
1.0 0.8 0.6 0.4 0.2 0.0 20 30 40 50 60 70 80 90
-0.1
-0.15 -2.0 20
Ambient Temperature(J)
Ambient Temperature(J)
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 500 550 600 650 700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDUR63533/L35 Page 4/5
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350XC Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile Dip Soldering Preheat: 120XC Max Preheat time: 60seconds Max Ramp-up 2XC/sec(max) Ramp-Down:-5XC/sec(max) Solder Bath:260XC Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body)
Temp(XC) 260XC3sec Max
260X
5X/sec max
120X
2X/sec max Preheat 60 Seconds Max
25X 0X 0
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LDUR63533/L35 Page 5/5
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 JO 5J 2.RH=90 %~95% 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 JO 5J&-40JO 5J (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2


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